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Serial EEPROM. AT24CSW021 Datasheet

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Serial EEPROM. AT24CSW021 Datasheet
















AT24CSW021 EEPROM. Datasheet pdf. Equivalent













Part

AT24CSW021

Description

Serial EEPROM



Feature


AT24CSW01X/AT24CSW02X I²C-Compatible (T wo-Wire) Serial EEPROM with a Security Register and Software Write Protection 1‑Kbit (128 x 8), 2‑Kbit (256 x 8) Features • Low-Voltage Operation: VCC = 1.7V to 3.6V • Internally Org anized as 128 x 8 (1K) or 256 x 8 (2K) • Software Write Protection of the EE PROM Array: – Five configuration opti ons – Protection settings can be .
Manufacture

Microchip

Datasheet
Download AT24CSW021 Datasheet


Microchip AT24CSW021

AT24CSW021; made permanent • 256-Bit Security Regi ster: – Preprogrammed 128-bit serial number – Additional 16 bytes of free user EEPROM provided to store critical user data • Factory Set Hardware Clie nt Address: – Unique ordering code fo r each available client address value ( AT24CSW01X/AT24CSW02X) • Industrial T emperature Range: -40°C to +85°C • I2C-Compatible (Two-Wire) Serial I.


Microchip AT24CSW021

nterface: – 100 kHz Standard Mode, 1.7 V to 3.6V – 400 kHz Fast Mode, 1.7V t o 3.6V – 1 MHz Fast Mode Plus (FM+), 1.7V to 3.6V • Schmitt Triggers, Filt ered Inputs for Noise Suppression • B idirectional Data Transfer Protocol • Ultra Low Active Current (1 mA maximum ) and Standby Current (0.8 μA maximum) • 8-Byte Page Write Mode: – Partia l page writes allowed • Random and .


Microchip AT24CSW021

Sequential Read Modes • Self-Timed Wri te Cycle within 5 ms Maximum • ESD Pr otection > 4,000V • High Reliability: – Endurance: 1,000,000 write cycles – Data retention: 100 years • Green Package Options (Lead-free/Halide-free /RoHS compliant) • Die Sale Option: W afer Form Packages • 5-Lead SOT23 and 4-Ball Ultra-Thin WLCSP © 2020-2021 Microchip Technology Inc. and its s.





Part

AT24CSW021

Description

Serial EEPROM



Feature


AT24CSW01X/AT24CSW02X I²C-Compatible (T wo-Wire) Serial EEPROM with a Security Register and Software Write Protection 1‑Kbit (128 x 8), 2‑Kbit (256 x 8) Features • Low-Voltage Operation: VCC = 1.7V to 3.6V • Internally Org anized as 128 x 8 (1K) or 256 x 8 (2K) • Software Write Protection of the EE PROM Array: – Five configuration opti ons – Protection settings can be .
Manufacture

Microchip

Datasheet
Download AT24CSW021 Datasheet




 AT24CSW021
AT24CSW01X/AT24CSW02X
I²C-Compatible (Two-Wire) Serial EEPROM with
a Security Register and Software Write Protection
1Kbit (128 x 8), 2Kbit (256 x 8)
Features
• Low-Voltage Operation:
– VCC = 1.7V to 3.6V
• Internally Organized as 128 x 8 (1K) or 256 x 8 (2K)
• Software Write Protection of the EEPROM Array:
– Five configuration options
– Protection settings can be made permanent
• 256-Bit Security Register:
– Preprogrammed 128-bit serial number
– Additional 16 bytes of free user EEPROM provided to store critical user data
• Factory Set Hardware Client Address:
– Unique ordering code for each available client address value (AT24CSW01X/AT24CSW02X)
• Industrial Temperature Range: -40°C to +85°C
• I2C-Compatible (Two-Wire) Serial Interface:
– 100 kHz Standard Mode, 1.7V to 3.6V
– 400 kHz Fast Mode, 1.7V to 3.6V
– 1 MHz Fast Mode Plus (FM+), 1.7V to 3.6V
• Schmitt Triggers, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• Ultra Low Active Current (1 mA maximum) and Standby Current (0.8 μA maximum)
• 8-Byte Page Write Mode:
– Partial page writes allowed
• Random and Sequential Read Modes
• Self-Timed Write Cycle within 5 ms Maximum
• ESD Protection > 4,000V
• High Reliability:
– Endurance: 1,000,000 write cycles
– Data retention: 100 years
• Green Package Options (Lead-free/Halide-free/RoHS compliant)
• Die Sale Option: Wafer Form
Packages
• 5-Lead SOT23 and 4-Ball Ultra-Thin WLCSP
© 2020-2021 Microchip Technology Inc.
and its subsidiaries
Datasheet
DS20006396B-page 1




 AT24CSW021
AT24CSW01X/AT24CSW02X
Table of Contents
Features......................................................................................................................................................... 1
Packages........................................................................................................................................................1
1. Package Types (not to scale)..................................................................................................................4
2. Pin Descriptions...................................................................................................................................... 5
2.1. Serial Clock (SCL)........................................................................................................................5
2.2. Ground (GND).............................................................................................................................. 5
2.3. Serial Data (SDA).........................................................................................................................5
2.4. Device Power Supply (VCC)......................................................................................................... 5
2.5. Write-Protect (WP)....................................................................................................................... 5
3. Description.............................................................................................................................................. 7
3.1. System Configuration Using Two-Wire Serial EEPROMs ........................................................... 7
3.2. Block Diagram.............................................................................................................................. 8
4. Electrical Characteristics.........................................................................................................................9
4.1. Absolute Maximum Ratings..........................................................................................................9
4.2. DC and AC Operating Range.......................................................................................................9
4.3. DC Characteristics....................................................................................................................... 9
4.4. AC Characteristics......................................................................................................................10
4.5. Electrical Specifications..............................................................................................................11
5. Device Operation and Communication................................................................................................. 13
5.1. Clock and Data Transition Requirements...................................................................................13
5.2. Start and Stop Conditions.......................................................................................................... 13
5.3. Acknowledge and No-Acknowledge...........................................................................................14
5.4. Standby Mode............................................................................................................................ 14
5.5. Software Reset...........................................................................................................................14
6. Memory Organization............................................................................................................................16
6.1. Device Addressing..................................................................................................................... 16
7. Write Operations................................................................................................................................... 18
7.1. Byte Write...................................................................................................................................18
7.2. Page Write..................................................................................................................................18
7.3. Acknowledge Polling.................................................................................................................. 19
7.4. Write Cycle Timing..................................................................................................................... 19
8. Write Protection.....................................................................................................................................21
8.1. Hardware Write Protection......................................................................................................... 21
8.2. Software Write Protection of the EEPROM Array...................................................................... 21
8.3. Writing to the Write Protection Register..................................................................................... 23
8.4. Reading the Write Protection Register....................................................................................... 23
9. Read Operations................................................................................................................................... 25
9.1. Current Address Read................................................................................................................25
© 2020-2021 Microchip Technology Inc.
and its subsidiaries
Datasheet
DS20006396B-page 2




 AT24CSW021
AT24CSW01X/AT24CSW02X
9.2. Random Read............................................................................................................................ 25
9.3. Sequential Read.........................................................................................................................26
10. Security Register...................................................................................................................................27
10.1. Custom Programming Option.....................................................................................................27
10.2. Read Operations in the Security Register.................................................................................. 27
10.3. Write Operations in the Security Register.................................................................................. 28
11. Device Default Condition from Microchip.............................................................................................. 30
12. Packaging Information.......................................................................................................................... 31
12.1. Package Marking Information.....................................................................................................31
13. Revision History.................................................................................................................................... 36
The Microchip Website.................................................................................................................................37
Product Change Notification Service............................................................................................................37
Customer Support........................................................................................................................................ 37
Product Identification System.......................................................................................................................38
Microchip Devices Code Protection Feature................................................................................................ 38
Legal Notice................................................................................................................................................. 39
Trademarks.................................................................................................................................................. 39
Quality Management System....................................................................................................................... 40
Worldwide Sales and Service.......................................................................................................................41
© 2020-2021 Microchip Technology Inc.
and its subsidiaries
Datasheet
DS20006396B-page 3




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