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Surface-Mount Chip. THJP0805 Datasheet

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Surface-Mount Chip. THJP0805 Datasheet
















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Part

THJP0805

Description

Thermal Jumper Surface-Mount Chip



Feature


www.vishay.com THJP Vishay Dale Thin Fi lm ThermaWickTM Thermal Jumper Surface Mount Chip LINKS TO ADDITIONAL RESOUR CES 3D 3D 3D Models Infographics THJ P surface mount chips are designed to p rovide an electrically isolated thermal conductive pathway to a ground plane o r heat sink while maintaining the elect rical isolation of the device. The devi ces are constructe.
Manufacture

Vishay

Datasheet
Download THJP0805 Datasheet


Vishay THJP0805

THJP0805; d with aluminum nitride substrates in bo th SnPb and Pb-free wraparound terminat ion styles. The low capacitance of the device makes them an excellent choice f or high frequency and thermal ladder ap plications. Custom sizes available. CO NSTRUCTION Solder coating Nickel term ination Aluminum nitride substrate FEA TURES • Electrically isolated therma l conductor • High .


Vishay THJP0805

thermal conductivity AlN substrate (170 W/mK) • Electrically isolated termina tions (> 999 MΩ) Available Available • Low capacitance • Available wit h SnPb or lead (Pb)-free wrap terminati ons Available • Material categoriza tion: for definitions of compliance ple ase see www.vishay.com/doc?99912 APPLI CATIONS • Power supplies and converte rs • RF amplifiers • Synthesi.


Vishay THJP0805

zers • Switch mode power supplies • Pin and laser diodes • Filters FUNCT IONAL APPLICATIONS / CONNECTION OPTIONS • Component to heat sink • Compone nt to case • Component to ground plan e • Pad to pad • Pad to via • Pad to trace HEAT TRANSFER DEMONSTRATION Chip surface temperature was measured u sing a FLIR SC645 thermal imaging syste m under ambient conditions. The devi.





Part

THJP0805

Description

Thermal Jumper Surface-Mount Chip



Feature


www.vishay.com THJP Vishay Dale Thin Fi lm ThermaWickTM Thermal Jumper Surface Mount Chip LINKS TO ADDITIONAL RESOUR CES 3D 3D 3D Models Infographics THJ P surface mount chips are designed to p rovide an electrically isolated thermal conductive pathway to a ground plane o r heat sink while maintaining the elect rical isolation of the device. The devi ces are constructe.
Manufacture

Vishay

Datasheet
Download THJP0805 Datasheet




 THJP0805
www.vishay.com
THJP
Vishay Dale Thin Film
ThermaWickTM Thermal Jumper Surface Mount Chip
LINKS TO ADDITIONAL RESOURCES
3D 3D
3D Models
Infographics
THJP surface mount chips are designed to provide an
electrically isolated thermal conductive pathway to a ground
plane or heat sink while maintaining the electrical isolation of
the device. The devices are constructed with aluminum
nitride substrates in both SnPb and Pb-free wraparound
termination styles. The low capacitance of the device makes
them an excellent choice for high frequency and thermal
ladder applications. Custom sizes available.
CONSTRUCTION
Solder coating
Nickel termination
Aluminum nitride
substrate
FEATURES
• Electrically isolated thermal conductor
• High thermal conductivity AlN substrate
(170 W/mK)
• Electrically isolated terminations (> 999 MΩ)
Available
Available
• Low capacitance
• Available with SnPb or lead (Pb)-free wrap
terminations
Available
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Power supplies and converters
• RF amplifiers
• Synthesizers
• Switch mode power supplies
• Pin and laser diodes
• Filters
FUNCTIONAL APPLICATIONS /
CONNECTION OPTIONS
• Component to heat sink
• Component to case
• Component to ground plane
• Pad to pad
• Pad to via
• Pad to trace
HEAT TRANSFER DEMONSTRATION
Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices
were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause
the surface temperature to stabilize at 150 °C. The device was then retested at the same power level with the thermal jumper
connecting the device to the heat sink.
Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction
Thermal jumper location
Ceramic Resistor Chip Without Thermal Jumper (149.8 °C)
Ceramic Chip Resistor With Thermal Jumper (95.5 °C)
Revision: 18-Mar-2021
1
Document Number: 60157
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000




 THJP0805
www.vishay.com
DIMENSIONS in inches
THJP
Vishay Dale Thin Film
W
L
T
CASE SIZE
0603
0612
0805
1206
1225
2512
L
0.061 ± 0.005
0.063 ± 0.005
0.079 ± 0.005
0.126 ± 0.005
0.126 ± 0.005
0.252 ± 0.005
D
D
W
0.033 ± 0.005
0.126 ± 0.005
0.047 ± 0.005
0.063 ± 0.005
0.252 ± 0.005
0.126 ± 0.005
TYPICAL CHARACTERISTICS
CASE SIZE
Thermal resistance (°C/W), TR
Thermal conductance (mW/°C), TC
Capacitance (pF)
Dielectric withstanding voltage kVAC, RMS (60 Hz)
Note
TR
=
------------L------------
k (T W)
where k is the thermal conductivity of AIN, 170 W/mK
TC
=
--1----
TR
0603
14
70
0.07
> 1.5
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Operating temperature range
Storage temperature range
0612
4
259
0.26
> 1.5
T
0.030 ± 0.005
0.030 ± 0.005
0.030 ± 0.005
0.030 ± 0.005
0.030 ± 0.005
0.030 ± 0.005
0805
13
77
0.15
> 1.5
1206
15
65
0.07
> 1.5
SPECIFICATIONS
-65 °C to +150 °C
-65 °C to +150 °C
D
0.015 ± 0.005
0.015 ± 0.005
0.020 ± 0.005
0.020 ± 0.005
0.020 ± 0.005
0.020 ± 0.005
1225
4
259
0.26
> 1.5
2512
15
65
0.07
> 1.5
STANDARD MATERIAL SPECIFICATIONS
Substrate material
Termination (tin / lead)
Termination (lead (Pb)-free)
Aluminum nitride (170 W/mK)
Electroplate tin / lead over electroplate nickel
Electroplate tin (e3) over electroplate nickel
ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 / AEC-Q200 Requirements)
ENVIRONMENTAL TEST
CONDITIONS
LIMITS
TYPICAL VISHAY
PERFORMANCE
Solderability
Visual
J-STD-002, method B and B1
95 %
Acceptable
Solder mounting integrity
Visual
MIL-PRF-55342, method par. 4.8.13.1
Pass / fail
Pass
Board flex
Visual
AEC-Q200, method 005
Pass / fail
Pass
Revision: 18-Mar-2021
2
Document Number: 60157
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000




 THJP0805
www.vishay.com
THJP
Vishay Dale Thin Film
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: THJP1206AST1
T
H
J
P
1
2
0
6
A
S
T
1
GLOBAL MODEL
THJP
CASE SIZE
0603
0805
0612
1206
1225
2512
THICKNESS
A = 0.030"
TERMINATION
B = wraparound Sn/Pb solder
with nickel termination
S = wraparound Sn (e3) solder
with nickel termination
RoHS compliant
PACKAGING
BS = BULK 100 min., 1 mult.
TAPE AND REEL
T0 = 100 min., 100 mult.
T1 = 1000 min., 1000 mult.
T3 = 300 min., 300 mult.
T5 = 500 min., 500 mult.
TF = full reel
TS = 100 min., 1 mult.
TI = 100 min., 1 mult.
(item single lot date code)
TP = 100 min., 1 mult.
(package unit single lot date code)
Revision: 18-Mar-2021
3
Document Number: 60157
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000




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