DatasheetsPDF.com

Power-Distribution Switches. TPS2555 Datasheet

DatasheetsPDF.com

Power-Distribution Switches. TPS2555 Datasheet






TPS2555 Switches. Datasheet pdf. Equivalent




TPS2555 Switches. Datasheet pdf. Equivalent





Part

TPS2555

Description

Power-Distribution Switches



Feature


www.ti.com TPS2554 TPS2555 SLVSAM0 – JUNE 2011 Precision Adjustable Current- Limited, Power-Distribution Switches Ch eck for Samples: TPS2554, TPS2555 FEAT URES 1 •2 Meets USB Current-Limiting Requirements • Adjustable Current Lim it, 500 mA to 2.5 A (typ) • Two Indep endently-Settable, Current-Limit Thresh olds • Fast Overcurrent Response - 1. 5 μs (typ) • 73-mΩ High-Side.
Manufacture

Texas Instruments

Datasheet
Download TPS2555 Datasheet


Texas Instruments TPS2555

TPS2555; MOSFET • 3.8-μA Maximum Standby Supp ly Current • PowerPAD™ Thermal Mana gement • Automatic Output Discharge w hen Disabled • Both High-Enable (TPS2 554) and Low-Enable (TPS2555) Versions Available APPLICATIONS • USB Ports/H ubs • Digital TV • Set-Top Boxes VOIP Phones DESCRIPTION The TPS2554/5 5 power-distribution switches are inten ded for applications where precision .


Texas Instruments TPS2555

current limiting is required or heavy ca pacitive loads and short circuits are e ncountered. These devices offer a progr ammable current-limit threshold between 500 mA and 2.5 A (typ) via an external resistor. TPS2554/55 devices limit the output current to a safe level by swit ching into a constant-current mode when the output load exceeds the current-li mit threshold. The.


Texas Instruments TPS2555

FAULT logic output asserts low during o vercurrent and over-temperature conditi ons. TPS2554/55 DRC Package and Typica l Application Diagram TPS2554/TPS2555 DRC PACKAGE (TOP VIEW) GND 1 IN 2 IN 3 ILIM_SEL 4 EN/EN 5 10 FAULT 9 OUT P AD 8 OUT 7 ILIM0 6 ILIM1 4.5 V to 5 .5 V FAULT Signal RFAULT Power Switc h Enable TPS2554/55 2/3 IN OUT 8/9 100 nF 10 FAULT .

Part

TPS2555

Description

Power-Distribution Switches



Feature


www.ti.com TPS2554 TPS2555 SLVSAM0 – JUNE 2011 Precision Adjustable Current- Limited, Power-Distribution Switches Ch eck for Samples: TPS2554, TPS2555 FEAT URES 1 •2 Meets USB Current-Limiting Requirements • Adjustable Current Lim it, 500 mA to 2.5 A (typ) • Two Indep endently-Settable, Current-Limit Thresh olds • Fast Overcurrent Response - 1. 5 μs (typ) • 73-mΩ High-Side.
Manufacture

Texas Instruments

Datasheet
Download TPS2555 Datasheet




 TPS2555
www.ti.com
TPS2554
TPS2555
SLVSAM0 JUNE 2011
Precision Adjustable Current-Limited, Power-Distribution Switches
Check for Samples: TPS2554, TPS2555
FEATURES
1
2 Meets USB Current-Limiting Requirements
Adjustable Current Limit, 500 mA to 2.5 A (typ)
Two Independently-Settable, Current-Limit
Thresholds
Fast Overcurrent Response - 1.5 μs (typ)
73-mHigh-Side MOSFET
3.8-μA Maximum Standby Supply Current
PowerPADThermal Management
Automatic Output Discharge when Disabled
Both High-Enable (TPS2554) and Low-Enable
(TPS2555) Versions Available
APPLICATIONS
USB Ports/Hubs
Digital TV
Set-Top Boxes
VOIP Phones
DESCRIPTION
The TPS2554/55 power-distribution switches are
intended for applications where precision current
limiting is required or heavy capacitive loads and
short circuits are encountered. These devices offer a
programmable current-limit threshold between 500
mA and 2.5 A (typ) via an external resistor.
TPS2554/55 devices limit the output current to a safe
level by switching into a constant-current mode when
the output load exceeds the current-limit threshold.
The FAULT logic output asserts low during
overcurrent and over-temperature conditions.
TPS2554/55 DRC Package and Typical Application Diagram
TPS2554/TPS2555
DRC PACKAGE
(TOP VIEW)
GND 1
IN 2
IN 3
ILIM_SEL 4
EN/EN 5
10 FAULT
9 OUT
PAD
8 OUT
7 ILIM0
6 ILIM1
4.5 V to 5.5 V
FAULT Signal
RFAULT
Power Switch
Enable
TPS2554/55
2/3 IN
OUT 8/9
100 nF
10 FAULT
ILIM_SEL 4
ILIM0 7
5 EN/EN
Power
PAD
ILIM1 6
GND
1
VBUS
120 mF
Current Limit
Select
2x RILIMx
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated




 TPS2555
TPS2554
TPS2555
SLVSAM0 JUNE 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1) (2)
VALUE
UNIT
Voltage range on IN, OUT, EN or EN, ILIM0, ILIM1, ILIM_SEL, FAULT
Voltage range from IN to OUT
0.3 to 7
V
7 to 7
IOUT Continuous output current
Continuous total power dissipation
Internally limited
Internally limited
Continuous FAULT sink current
ILIM source current
25
mA
Internally limited
HBM
ESD
CDM
TJ Maximum junction temperature
Tstg Storage temperature range
2
kV
500
V
40 to OTSD2(3)
°C
-65 to 150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltages are referenced to GND unless otherwise noted.
(3) Ambient over-temperature shutdown threshold.
RECOMMENDED OPERATING CONDITIONS
VIN
VEN , VEN ,
ILIM_SEL
IOUT
TJ
RILIM
Input voltage, IN
Logic-level inputs
Continuous output current, OUT
Operating virtual junction temperature
Recommended resistor limit range
MIN
MAX UNIT
4.5
5.5
V
0
5.5
0
2.5 A
40
125 °C
16.9
750 kΩ
2
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TPS2554 TPS2555




 TPS2555
www.ti.com
TPS2554
TPS2555
SLVSAM0 JUNE 2011
THERMAL INFORMATION
THERMAL METRIC(1)
TPS2554/TPS2555
DRC
UNITS
θJA
θJCtop
θJB
ψJT
ψJB
θJCbot
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
Junction-to-case (bottom) thermal resistance(7)
14 PINS
45.9
53.4
21.4
1.0
21.6
5.9
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Copyright © 2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TPS2554 TPS2555



Recommended third-party TPS2555 Datasheet






@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)