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MIPI Switch. FSA642 Datasheet

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MIPI Switch. FSA642 Datasheet
















FSA642 Switch. Datasheet pdf. Equivalent













Part

FSA642

Description

High-Speed MIPI Switch



Feature


FSA642 — Low-Power, Three-Port, High-S peed MIPI Switch FSA642 Low-Power, Thr ee-Port, High-Speed MIPI Switch Featur es  Low On Capacitance: 7.0 pF Typic al  Low On Resistance: 7.0 Ω Typic al  Wide -3db Bandw idth: 1 GHz Typi cal  24-Lead UMLP (2.5 x 3.4 mm) Pac kage  8 kV ESD Rating; >16 kV Pow er /GND ESD Rating Applications  Dual C amera Applications for Cell Phones.
Manufacture

ON Semiconductor

Datasheet
Download FSA642 Datasheet


ON Semiconductor FSA642

FSA642;  Dual LCD Applications for Cell Phon es, Digital Camera Displays, and View f inders Description The FSA642 is a bi- directional, low -pow er, high-speed an alog sw itch. The pin out is designed t o ease differential signal layout and i s configured as a triplepole, double-th row sw itch (TPDT). The FSA642 is optim ized for sw itching betw een tw o MIPI devices, such as cam.


ON Semiconductor FSA642

eras or LCD displays and on-board Multim edia Application Processors (MAP). The FSA642 is compatible w ith the requirem ents of Mobile Industry Processor Inter face (MIPI). The low capacitance design allow s the FSA642 to sw itch signals that exceed 500 MHz in frequency. Super ior channel-tochannel crosstalk immunit y minimizes interference and allow s th e transmission of .


ON Semiconductor FSA642

high-speed differential signals and sing le-ended signals, as described by the M IPI s pec if ic ation. Ordering Inform ation Part Number Top Mark Operating T emperature Range Package FSA642UMX J G -40 to +85°C 24-Lead, Quad, Ultrat hin Molded Leadless Package (UMLP), 2.5 x 3.4 mm Camera 1 Camera 2 D C DD C FSA642 D C MAP Processor LCD 1 LCD 2 D C DD C .





Part

FSA642

Description

High-Speed MIPI Switch



Feature


FSA642 — Low-Power, Three-Port, High-S peed MIPI Switch FSA642 Low-Power, Thr ee-Port, High-Speed MIPI Switch Featur es  Low On Capacitance: 7.0 pF Typic al  Low On Resistance: 7.0 Ω Typic al  Wide -3db Bandw idth: 1 GHz Typi cal  24-Lead UMLP (2.5 x 3.4 mm) Pac kage  8 kV ESD Rating; >16 kV Pow er /GND ESD Rating Applications  Dual C amera Applications for Cell Phones.
Manufacture

ON Semiconductor

Datasheet
Download FSA642 Datasheet




 FSA642
FSA642
Low-Power, Three-Port, High-Speed MIPI Switch
Features
Low On Capacitance: 7.0 pF Typical
Low On Resistance: 7.0 Ω Typical
Wide -3db Bandw idth: 1 GHz Typical
24-Lead UMLP (2.5 x 3.4 mm) Package
8 kV ESD Rating; >16 kV Pow er/GND ESD Rating
Applications
Dual Camera Applications for Cell Phones
Dual LCD Applications for Cell Phones,
Digital Camera Displays, and View finders
Description
The FSA642 is a bi-directional, low -pow er, high-speed
analog sw itch. The pin out is designed to ease
differential signal layout and is configured as a triple-
pole, double-throw sw itch (TPDT). The FSA642 is
optimized for sw itching betw een tw o MIPI devices, such
as cameras or LCD displays and on-board Multimedia
Application Processors (MAP).
The FSA642 is compatible w ith the requirements of
Mobile Industry Processor Interface (MIPI). The low -
capacitance design allow s the FSA642 to sw itch signals
that exceed 500 MHz in frequency. Superior channel-to-
channel crosstalk immunity minimizes interference and
allow s the transmission of high-speed differential signals
and single-ended signals, as described by the MIPI
s pec if ic ation.
Ordering Information
Part Number Top Mark Operating Temperature Range
Package
FSA642UMX
JG
-40 to +85°C
24-Lead, Quad, Ultrathin Molded Leadless
Package (UMLP), 2.5 x 3.4 mm
Camera 1 Camera 2
D
C
DD C
FSA642
D
C
MAP Processor
LCD 1
LCD 2
D
C
DD C
FSA642
D
C
MAP Processor
Figure 1. Application Block Diagram
© 2008 Semiconductor Components Industries, LLC.
December-2017, Rev. 2
Publication Order Number:
FSA642/D




 FSA642
Pin Configuration
18 17 16 15 14 13
19 DB2P
20 DB1P
21 DB1N
22 CLKBP
23 CLKBN
24 NC
642
DA2N 12
SEL 11
VCC 10
GND 9
/OE 8
NC 7
123456
Figure 2. Pin Configuration (Top Through View )
Pin Definitions
Pin #
1, 2
3, 4
5, 6
7, 24
8
9
10
11
12, 13
14, 15
16, 17
18, 19
20, 21
22, 23
Name
CLKP, CLKN
D1P, D1N
D2P, D2N
NC
/OE
GND
VCC
SEL
DA2N, DA2P
DA1N, DA1P
CLKAN, CLKAP
DB2N, DB2P
DB1P, DB1N
CLKBP, CLKBN,
Clock Path (Common)
Description
Data Path 1 (Common)
Data Path 2 (Common)
No Connect (Float)
Output Enable (Active Low )
Ground
Pow er
Select (0=A, 1=B)
Data Path (A2)
Data Path (A1)
Clock Path (A)
Data Path (2B)
Data Path (1B)
Clock Path (B)
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2




 FSA642
Functional Diagram
(1) CLKP
(2) CLKN
(3) D1P
(4) D1N
(5) D2P
(6) D2N
(8) /OE
(11) SEL
FSA642
CLKAP (17)
CLKAN (16)
DA1P (15)
DA1N (14)
DA2P (13)
DA2N (12)
Sw itch
Control
CLKBP (22)
CLKBN (23)
DB1P (20)
DB1N (21)
DB2P (19)
DB2N (18)
(10) VCC
(9) GND
Figure 3. Functional Diagram
Truth Table
SEL
Don’t Care
LOW
HIGH
/OE
HIGH
LOW
LOW
Function
Disconnect
D1, D2, CLK=DA1, DA2, CLKA
D1, D2, CLK=DB1, DB2, CLKB
www.onsemi.com
3




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