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Static RAM. CY62128B Datasheet

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Static RAM. CY62128B Datasheet
















CY62128B RAM. Datasheet pdf. Equivalent













Part

CY62128B

Description

128K x 8 Static RAM



Feature


CY62128B MoBL 128K x 8 Static RAM Fe atures • Temperature Ranges — Comme rcial: 0°C to 70°C — Industrial: 40°C to 85°C — Automotive: –40° C to 125°C www.DataSheet4U.com Functi onal Description[1] The CY62128B is a h igh-performance CMOS static RAM organiz ed as 131,072 words by 8 bits. Easy mem ory expansion is provided by an active LOW Chip Enable (CE1), an active HIGH .
Manufacture

Cypress Semiconductor

Datasheet
Download CY62128B Datasheet


Cypress Semiconductor CY62128B

CY62128B; Chip Enable (CE2), an active LOW Output Enable (OE), and three-state drivers. T his device has an automatic power-down feature that reduces power consumption by more than 75% when deselected. Writi ng to the device is accomplished by tak ing Chip Enable One (CE1) and Write Ena ble (WE) inputs LOW and Chip Enable Two (CE2) input HIGH. Data on the eight I/ O pins (I/O0 throu.


Cypress Semiconductor CY62128B

gh I/O7) is then written into the locati on specified on the address pins (A0 th rough A16). Reading from the device is accomplished by taking Chip Enable One (CE1) and Output Enable (OE) LOW while forcing Write Enable (WE) and Chip Enab le Two (CE2) HIGH. Under these conditio ns, the contents of the memory location specified by the address pins will app ear on the I/O pin.


Cypress Semiconductor CY62128B

s. The eight input/output pins (I/O0 thr ough I/O7) are placed in a high-impedan ce state when the device is deselected (CE1 HIGH or CE2 LOW), the outputs are disabled (OE HIGH), or during a write o peration (CE1 LOW, CE2 HIGH, and WE LOW ). The CY62128B is available in a stand ard 450-mil-wide SOIC, 32-pin TSOP type I and STSOP packages. • 4.5V – 5. 5V operation • CMOS fo.




Part

CY62128B

Description

128K x 8 Static RAM



Feature


CY62128B MoBL 128K x 8 Static RAM Fe atures • Temperature Ranges — Comme rcial: 0°C to 70°C — Industrial: 40°C to 85°C — Automotive: –40° C to 125°C www.DataSheet4U.com Functi onal Description[1] The CY62128B is a h igh-performance CMOS static RAM organiz ed as 131,072 words by 8 bits. Easy mem ory expansion is provided by an active LOW Chip Enable (CE1), an active HIGH .
Manufacture

Cypress Semiconductor

Datasheet
Download CY62128B Datasheet




 CY62128B
CY62128B
MoBL
128K x 8 Static RAM
Features
• Temperature Ranges
— Commercial: 0°C to 70°C
— Industrial: –40°C to 85°C
— Automotive: –40°C to 125°C
• 4.5V – 5.5V operation
www.DataSheet4UC.cMoOmS for optimum speed/power
• Low active power
(70 ns, LL version, Commercial, Industrial)
— 82.5 mW (max.) (15 mA)
• Low standby power
(70 ns, LL version, Commercial, Industrial)
— 110 µW (max.) (15 µA)
• Automatic power-down when deselected
• TTL-compatible inputs and outputs
• Easy memory expansion with CE1, CE2, and OE options
Functional Description[1]
The CY62128B is a high-performance CMOS static RAM
organized as 131,072 words by 8 bits. Easy memory
expansion is provided by an active LOW Chip Enable (CE1),
an active HIGH Chip Enable (CE2), an active LOW Output
Enable (OE), and three-state drivers. This device has an
automatic power-down feature that reduces power
consumption by more than 75% when deselected.
Writing to the device is accomplished by taking Chip Enable
One (CE1) and Write Enable (WE) inputs LOW and Chip
Enable Two (CE2) input HIGH. Data on the eight I/O pins (I/O0
through I/O7) is then written into the location specified on the
address pins (A0 through A16).
Reading from the device is accomplished by taking Chip
Enable One (CE1) and Output Enable (OE) LOW while forcing
Write Enable (WE) and Chip Enable Two (CE2) HIGH. Under
these conditions, the contents of the memory location
specified by the address pins will appear on the I/O pins.
The eight input/output pins (I/O0 through I/O7) are placed in a
high-impedance state when the device is deselected (CE1
HIGH or CE2 LOW), the outputs are disabled (OE HIGH), or
during a write operation (CE1 LOW, CE2 HIGH, and WE LOW).
The CY62128B is available in a standard 450-mil-wide SOIC,
32-pin TSOP type I and STSOP packages.
Logic Block Diagram
A0
A1
A2
A3
A4
A5
A6
A7
A8
CCEE12
WE
OE
INPUT BUFFER
512x 256x 8
ARRAY
COLUMN
DECODER
POWER
DOWN
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Cypress Semiconductor Corporation • 3901 North First Street • San Jose, CA 95134 • 408-943-2600
Document #: 38-05300 Rev. *C
Revised February 14, 2005




 CY62128B
CY62128B
MoBL
Product Portfolio
Product
CY62128BLL Industrial
Industrial
Automotive
Pin Configurations
www.DataSheet4U.com
Min.
4.5
VCC Range (V)
Typ.[2]
5.0
Max.
5.5
Speed
(ns)
55
70
70
Power Dissipation
Operating,
(mA)
ICC
Typ.[2] Max.
Standby,
(µA)
ISB2
Typ.[2] Max.
7.5 20 2.5 15
6 15 2.5 15
6 25 2.5 25
Top View
SOIC
NC 1
A16 2
A14 3
A12 4
A7 5
A6 6
A5 7
A4 8
A3 9
A2 10
A1 11
A0 12
I/O0 13
I/O1 14
GIGgG/OnN2NcD
15
16
32 VCC
31 A15
30 CE2
29 WE
28 A13
27 A8
26 A9
25 A11
24 OE
23 A10
22 CE1
21 I/O7
20 I/O6
19 I/O5
18 I/O4
17 I/O3
AA45
VCAWAAANCAEA1111CCE6742562
AAAA111389
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Reverse TSOP I
Top View
(not to scale)
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
IIIAAAA///OOO1032 210
GIIICAII/////OOOOO1EN0745631D
OE
WAAAA11E1893
CVAAAANCEAAAA1111CC674526425
25
26
27
28
29
30
31
32
1
2
3
4
5
6
7
8
STSOP
Top View
(not to scale)
24 OE
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
IIGIIIIICAIAAAA////////OOOOOOOO11032EN0217456031D
CVWAAAAAANCEAAAAAA111111CEC1642356748952
12
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TSOP I
Top View
(not to scale)
3321
30
29
28
27
26
2255
24
23
22
21
20
19
18
17
OE
IGIIIICIAAAAAII////////OOOOOOOO11032EN0217450316D
Pin Definitions
Input
Input/Output
Input/Control
A0-A16. Address Inputs
I/O0-I/O7. Data lines. Used as input or output lines depending on operation
WE. Write Enable, Active LOW. When selected LOW, a WRITE is conducted. When selected HIGH, a READ
is conducted.
Input/Control
Input/Control
Input/Control
CE1. Chip Enable 1, Active LOW.
CE2. Chip Enable 2, Active HIGH.
OE. Output Enable, Active LOW. Controls the direction of the I/O pins. When LOW, the I/O pins behave as
outputs. When deasserted HIGH, I/O pins are three-stated, and act as input data pins
Ground
GND. Ground for the device
Power Supply
VCC. Power supply for the device
Notes:
2. Typical values are included for reference only and are not tested or guaranteed. Typical values are an average of the distribution across normal production
variations as measured at VCC = 5.0V, TA = 25°C, and tAA = 70 ns.
Document #: 38-05300 Rev. *C
Page 2 of 11




 CY62128B
CY62128B
MoBL
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage on VCC to Relative GND[3] .... –0.5V to +7.0V
DC Voltage Applied to Outputs
in High-Z State[3] ....................................–0.5V to VCC + 0.5V
DC Input Voltage[3].................................–0.5V to VCC + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage........................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current..................................................... > 200 mA
Operating Range
Range
Commercial
Industrial
Automotive
TempAermabtuierent(TA)[4]
0°C to +70°C
–40°C to +85°C
–40°C to +125°C
VCC
5V ± 10%
5V ± 10%
5V ± 10%
www.DataSheetE4Ule.ccotmrical Characteristics Over the Operating Range
Parameter
Description
VOH Output HIGH Voltage
VOL Output LOW Voltage
VIH Input HIGH Voltage
Test Conditions
VCC = Min., IOH = –1.0 mA
VCC = Min., IOL = 2.1 mA
VIL Input LOW Voltage[3]
IIX
Input Load Current
GND VI VCC
Automotive
IOZ
Output Leakage
GND VI VCC,
Current
Output Disabled Automotive
IOS
Output Short Circuit
Current[5]
VCC = Max., VOUT = GND
ICC
VCC Operating
VCC = Max.,
Industrial,
Supply Current
IOUT = 0 mA,
Commercial
f = fMAX = 1/tRC
Automotive
ISB1 Automatic CE
Max. VCC,
Industrial
Power-down Current CE1 VIH
Commercial
—TTL Inputs
or CE2 < VIL,
VIN VIH or
Automotive
VIN VIL, f = fMAX
ISB2 Automatic CE
Max. VCC,
Industrial
Power-down Current CE1 VCC – 0.3V, Commercial
—CMOS Inputs
or CE2 0.3V,
VIN VCC – 0.3V,
Automotive
or VIN 0.3V, f = 0
CY62128B-55
CY62128B-70
Min. Typ.[2] Max. Min. Typ.[2] Max. Unit
2.4 2.4
V
0.4 0.4 V
2.2 VCC+ 2.2 VCC+ V
0.3 0.3
–0.3 0.8 –0.3 0.8 V
–1 +1 –1 +1 µA
–10 +10 µA
–1 +1 –1 +1 µA
–10 +10 µA
–300
–300 mA
7.5 20
6 15 mA
0.1 2
6 25 mA
0.1 1 mA
0.1 2 mA
2.5 15
2.5 15 µA
2.5 25 µA
Thermal Resistance[6]
Parameter
Description
Test Conditions
32 SOIC 32 TSOP 32 STSOP 32 RTSOP
ΘJA
ΘJC
Thermal Resistance Test conditions follow standard test
(Junction to Ambient) methods and procedures for
Thermal Resistance
(Junction to Case)
measuring thermal impedance, per
EIA / JESD51.
66.17
30.87
97.44
26.05
105.14
14.09
97.44
26.05
Note:
3. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
4. TA is the “Instant On” case temperature.
5. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
6. Tested initially and after any design or process changes that may affect these parameters.
Unit
°C/W
°C/W
Document #: 38-05300 Rev. *C
Page 3 of 11




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